TPS657051YZHR
vs
RFPA2172TR13-5K
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
QORVO INC
|
| Part Package Code |
BGA
|
|
| Package Description |
0.50 MM PITCH, GREEN, DSBGA-16
|
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| JESD-30 Code |
S-XBGA-B16
|
|
| JESD-609 Code |
e1
|
|
| Length |
2.3 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Code |
VFBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.625 mm
|
|
| Supply Voltage-Nom |
3.6 V
|
|
| Surface Mount |
YES
|
|
| Telecom IC Type |
TELECOM CIRCUIT
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2.3 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TPS657051YZHR with alternatives
Compare RFPA2172TR13-5K with alternatives