TPS62660YFF
vs
MIC23030-AYMT
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
VFBGA,
|
HVSON,
|
Pin Count |
6
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
PFM CONTROL TECHNIQUE IS ALSO POSSIBLE
|
ALSO OPERATES IN ADJUSTABLE MODE FROM 0.7V TO 3.6V; ALSO HAS PFM CONTROL TECHNIQUE
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
VOLTAGE-MODE
|
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
5.5 V
|
5.5 V
|
Input Voltage-Min |
2.3 V
|
2.7 V
|
Input Voltage-Nom |
3.6 V
|
3.6 V
|
JESD-30 Code |
R-PBGA-B6
|
S-PDSO-N6
|
Length |
1.6 mm
|
1.6 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
1 A
|
1 A
|
Output Voltage-Nom |
1.8 V
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HVSON
|
Package Equivalence Code |
BGA6,2X3,16
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.625 mm
|
0.6 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
BUCK
|
Switching Frequency-Max |
6600 kHz
|
8000 kHz
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Width |
1.2 mm
|
1.6 mm
|
Base Number Matches |
3
|
3
|
Rohs Code |
|
Yes
|
Samacsys Manufacturer |
|
Microchip
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
1
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare TPS62660YFF with alternatives
Compare MIC23030-AYMT with alternatives