TPS2511QDGNQ1
vs
BQ25100HYFPR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
MSOP-8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Adjustable Threshold |
YES
|
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| Input Voltage-Max |
5.5 V
|
6.45 V
|
| Input Voltage-Min |
4.5 V
|
4.45 V
|
| JESD-30 Code |
S-PDSO-G8
|
R-XBGA-B6
|
| JESD-609 Code |
e4
|
e1
|
| Length |
3 mm
|
1 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Channels |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HTSSOP
|
VFBGA
|
| Package Equivalence Code |
TSSOP8,.19
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.1 mm
|
0.5 mm
|
| Supply Current-Max (Isup) |
0.23 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
6.45 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.45 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
1.4 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TPS2511QDGNQ1 with alternatives
Compare BQ25100HYFPR with alternatives