TPS2376DDAR-H
vs
TPS2376DR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOIC-8
|
SOP, SOP8,.25
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Adjustable Threshold |
YES
|
NO
|
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
Input Voltage-Max |
57 V
|
57 V
|
Input Voltage-Min |
|
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e4
|
Length |
4.89 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HLSOP
|
SOP
|
Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.68 mm
|
1.75 mm
|
Supply Current-Max (Isup) |
0.6 mA
|
0.45 mA
|
Supply Voltage-Max (Vsup) |
57 V
|
57 V
|
Supply Voltage-Min (Vsup) |
|
|
Supply Voltage-Nom (Vsup) |
48 V
|
48 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3.9 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TPS2376DDAR-H with alternatives
Compare TPS2376DR with alternatives