TPS22960RSET
vs
FPF2303MX
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ONSEMI
|
| Package Description |
UQFN-8
|
SOP-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
onsemi
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| Input Voltage-Max |
5.5 V
|
|
| Input Voltage-Min |
1.62 V
|
|
| JESD-30 Code |
S-XQCC-N8
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
1.5 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
SOP
|
| Package Equivalence Code |
LCC8,.06SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.6 mm
|
1.75 mm
|
| Supply Current-Max (Isup) |
0.0012 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.62 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.5 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
751EB
|
| Factory Lead Time |
|
4 Weeks
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare TPS22960RSET with alternatives
Compare FPF2303MX with alternatives