TPS2231PWP
vs
TPS2231MRGP-1
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
TSSOP
|
QFN
|
Package Description |
GREEN, PLASTIC, HTSSOP-24
|
HVQCCN, LCC20,.16SQ,20
|
Pin Count |
24
|
20
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
JESD-30 Code |
R-PDSO-G24
|
S-PQCC-N20
|
JESD-609 Code |
e4
|
|
Length |
7.8 mm
|
4 mm
|
Moisture Sensitivity Level |
2
|
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTSSOP
|
HVQCCN
|
Package Equivalence Code |
TSSOP24,.25
|
LCC20,.16SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1 mm
|
Supply Current-Max (Isup) |
0.15 mA
|
|
Supply Voltage-Max (Vsup) |
13.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Threshold Voltage-Nom |
+1.35,3V
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
4.4 mm
|
4 mm
|
Base Number Matches |
4
|
2
|
|
|
|
Compare TPS2231PWP with alternatives
Compare TPS2231MRGP-1 with alternatives