TPA6130A2RTJTG4
vs
MAX9879ERV+T
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN, LCC20,.16SQ,20
|
,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
| Harmonic Distortion |
1%
|
|
| JESD-30 Code |
S-PQCC-N20
|
R-PBGA-B30
|
| JESD-609 Code |
e4
|
e1
|
| Length |
4 mm
|
3.05 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Channels |
2
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
30
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
0.138 W
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC20,.16SQ,20
|
BGA30,5X6,20
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
0.69 mm
|
| Supply Current-Max |
6 mA
|
24 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
1.7 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4 mm
|
2.54 mm
|
| Base Number Matches |
1
|
2
|
| Channel Separation |
|
75 dB
|
| Technology |
|
BICMOS
|
|
|
|
Compare TPA6130A2RTJTG4 with alternatives
Compare MAX9879ERV+T with alternatives