TPA302DG4
vs
MAX9702BETI+
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
QFN
|
| Package Description |
SOP, SOP8,.25
|
5 X 5 MM, 0.80 MM HEIGHT, LEAD FREE, MO-220WHHD-2, TQFN-28
|
| Pin Count |
8
|
28
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Bandwidth-Nom |
20 kHz
|
22 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Harmonic Distortion |
1%
|
|
| JESD-30 Code |
R-PDSO-G8
|
S-XQCC-N28
|
| JESD-609 Code |
e4
|
e3
|
| Length |
4.9 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
0.3 W
|
1.8 W
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
HVQCCN
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
1.75 mm
|
0.8 mm
|
| Supply Current-Max |
10 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
5 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
|
|
|
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