TPA3002D2PHPG4
vs
TPA3002D2PHP
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
HTFQFP, TQFP48,.35SQ
|
GREEN, PLASTIC, HTQFP-48
|
Pin Count |
48
|
48
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Channel Separation |
77 dB
|
77 dB
|
Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
Harmonic Distortion |
10%
|
10%
|
JESD-30 Code |
S-PQFP-G48
|
S-PQFP-G48
|
JESD-609 Code |
e4
|
e4
|
Length |
7 mm
|
7 mm
|
Moisture Sensitivity Level |
4
|
4
|
Noise Figure-Nom |
96 dB
|
96 dB
|
Number of Bands |
1
|
1
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
48
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
9 W
|
9 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTFQFP
|
HTFQFP
|
Package Equivalence Code |
TQFP48,.35SQ
|
TQFP48,.35SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Current-Max |
28.5 mA
|
28.5 mA
|
Supply Voltage-Max (Vsup) |
14 V
|
14 V
|
Supply Voltage-Min (Vsup) |
8.5 V
|
8.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
7 mm
|
7 mm
|
Base Number Matches |
1
|
4
|
Pbfree Code |
|
Yes
|
|
|
|
Compare TPA3002D2PHPG4 with alternatives
Compare TPA3002D2PHP with alternatives