TPA2037D1YFFT vs MAX9705AETB+ feature comparison

TPA2037D1YFFT Texas Instruments

Buy Now Datasheet

MAX9705AETB+ Analog Devices Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC ANALOG DEVICES INC
Part Package Code BGA 10-LFCSP-3X3X0.75
Package Description 1.21 X 1.16 MM, 0.40 MM PITCH, LEAD FREE, WCSP-9 3 X 3 MM, 0.80 MM HEIGHT, LEAD FREE, MO-229WEED-3, TDFN-10
Pin Count 9 10
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.33.00.01
Bandwidth-Nom 20 kHz 22 kHz
Consumer IC Type CLASS D AUDIO AMPLIFIER CLASS D AUDIO AMPLIFIER
JESD-30 Code S-XBGA-B9 S-XDSO-N10
JESD-609 Code e1 e3
Length 1.505 mm 3 mm
Moisture Sensitivity Level 1 1
Noise Figure-Nom 95 dB
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 9 10
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 3.2 W 2.3 W
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code VFBGA HVSON
Package Equivalence Code BGA9,3X3,16 SOLCC10,.12,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.625 mm 0.8 mm
Supply Current-Max 2.5 mA 7 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn)
Terminal Form BALL NO LEAD
Terminal Pitch 0.4 mm 0.5 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1.505 mm 3 mm
Base Number Matches 1 2
Manufacturer Package Code 10-LFCSP-3X3X0.75
Date Of Intro 2005-10-14
Samacsys Manufacturer Analog Devices
Gain 6 dB
Technology BICMOS

Compare TPA2037D1YFFT with alternatives

Compare MAX9705AETB+ with alternatives