TPA122DR
vs
TPA701DGNRG4
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
MSOP
Package Description
SOIC-8
HTSSOP, TSSOP8,.19
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Samacsys Manufacturer
Texas Instruments
Bandwidth-Nom
20 kHz
4 kHz
Consumer IC Type
AUDIO AMPLIFIER
AUDIO AMPLIFIER
Gain
6 dB
Harmonic Distortion
0.1%
0.5%
JESD-30 Code
R-PDSO-G8
S-PDSO-G8
JESD-609 Code
e4
e4
Length
4.9 mm
3 mm
Moisture Sensitivity Level
1
1
Number of Channels
2
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Power-Nom
0.15 W
0.7 W
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HTSSOP
Package Equivalence Code
SOP8,.25
TSSOP8,.19
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.1 mm
Supply Current-Max
3 mA
0.25 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3.9 mm
3 mm
Base Number Matches
2
1
Compare TPA122DR with alternatives
Compare TPA701DGNRG4 with alternatives