TP3005
vs
MRF858S
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Package Description
FLANGE MOUNT, R-CDFM-F6
FLATPACK, R-CDFP-F6
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
8541.29.00.75
Collector Current-Max (IC)
2 A
Collector-Base Capacitance-Max
12.5 pF
8 pF
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
15
30
Highest Frequency Band
ULTRA HIGH FREQUENCY BAND
ULTRA HIGH FREQUENCY BAND
JESD-30 Code
R-CDFM-F6
R-CDFP-F6
Number of Elements
1
1
Number of Terminals
6
6
Operating Temperature-Max
200 °C
200 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLATPACK
Polarity/Channel Type
NPN
NPN
Power Dissipation Ambient-Max
25 W
20 W
Power Dissipation-Max (Abs)
25 W
20 W
Power Gain-Min (Gp)
8.5 dB
11 dB
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
1
Pin Count
6
Manufacturer Package Code
CASE 319A-02
Additional Feature
WITH EMITTER BALLASTING RESISTORS
Collector-Emitter Voltage-Max
30 V
Transistor Application
AMPLIFIER
Compare TP3005 with alternatives
Compare MRF858S with alternatives