TP2330F
vs
SD1070
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MICROSEMI CORP
|
| Package Description |
,
|
POST/STUD MOUNT, O-MUPM-P3
|
| Reach Compliance Code |
unknown
|
unknown
|
| Collector Current-Max (IC) |
8 A
|
3 A
|
| Configuration |
Single
|
SINGLE
|
| DC Current Gain-Min (hFE) |
20
|
|
| Operating Temperature-Max |
200 °C
|
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation-Max (Abs) |
80 W
|
|
| Surface Mount |
NO
|
NO
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
TO-60
|
| Pin Count |
|
3
|
| ECCN Code |
|
EAR99
|
| Collector-Base Capacitance-Max |
|
20 pF
|
| Collector-Emitter Voltage-Max |
|
40 V
|
| Highest Frequency Band |
|
ULTRA HIGH FREQUENCY BAND
|
| JESD-30 Code |
|
O-MUPM-P3
|
| JESD-609 Code |
|
e0
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
3
|
| Package Body Material |
|
METAL
|
| Package Shape |
|
ROUND
|
| Package Style |
|
POST/STUD MOUNT
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
PIN/PEG
|
| Terminal Position |
|
UPPER
|
| Transistor Application |
|
AMPLIFIER
|
| Transistor Element Material |
|
SILICON
|
| Transition Frequency-Nom (fT) |
|
175 MHz
|
|
|
|
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