TP0725D309JRCE vs RP73F2E30R9DTG feature comparison

TP0725D309JRCE Royal Electronic Factory (Thailand) Co Ltd

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RP73F2E30R9DTG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ROYAL ELECTRONIC FTY CO LTD TE CONNECTIVITY LTD
Reach Compliance Code compliant unknown
ECCN Code EAR99
Construction Chip Chip
JESD-609 Code e3
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.1 mm 3.1 mm
Package Style SMT SMT
Package Width 2.5 mm 2.4 mm
Packing Method TR, Plastic BULK
Rated Power Dissipation (P) 0.333 W 0.3 W
Resistance 30.9 Ω 30.9 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Series TP
Size Code 1210 1210
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Tolerance 0.5% 0.5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Description CHIP
Additional Feature HIGH PRECISION
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Reference Standard MIL-STD-202
Surface Mount YES
Terminal Shape WRAPAROUND

Compare TP0725D309JRCE with alternatives

Compare RP73F2E30R9DTG with alternatives