TOP221GN
vs
TC33372VPA
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
POWER INTEGRATIONS INC
|
TELCOM SEMICONDUCTOR INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SMD-8
|
DIP, DIP8,.3
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
36 Weeks
|
|
| Date Of Intro |
1997-10-20
|
|
| Samacsys Manufacturer |
Power Integrations
|
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
SWITCHING REGULATOR
|
| Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
|
| Length |
9.59 mm
|
|
| Moisture Sensitivity Level |
4
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current-Max |
0.28 A
|
2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.73 mm
|
|
| Surface Mount |
YES
|
NO
|
| Switcher Configuration |
BOOST
|
|
| Switching Frequency-Max |
110 kHz
|
115 kHz
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.35 mm
|
|
| Base Number Matches |
2
|
1
|
| Input Voltage-Max |
|
700 V
|
| Package Equivalence Code |
|
DIP8,.3
|
|
|
|
Compare TOP221GN with alternatives
Compare TC33372VPA with alternatives