TN83C51FA-33
vs
LD83C51FC-33
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Part Package Code |
LCC
|
DIP
|
Package Description |
PLASTIC, LCC-44
|
CERDIP-40
|
Pin Count |
44
|
40
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
NO
|
CPU Family |
8051
|
8051
|
Clock Frequency-Max |
33 MHz
|
33 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQCC-J44
|
R-GDIP-T40
|
JESD-609 Code |
e0
|
e0
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
44
|
40
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC44,.7SQ
|
DIP40,.6
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
256
|
256
|
ROM (words) |
8192
|
32768
|
ROM Programmability |
MROM
|
MROM
|
Speed |
33 MHz
|
33 MHz
|
Supply Current-Max |
56 mA
|
56 mA
|
Supply Voltage-Max |
6 V
|
6 V
|
Supply Voltage-Min |
4 V
|
4 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Length |
|
52.26 mm
|
Width |
|
15.24 mm
|
|
|
|
Compare TN83C51FA-33 with alternatives
Compare LD83C51FC-33 with alternatives