TN80L188EB13 vs 79R3041-25JG feature comparison

TN80L188EB13 Intel Corporation

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79R3041-25JG Integrated Device Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC LCC
Package Description QCCJ, LDCC84,1.2SQ QCCJ, LDCC84,1.2SQ
Pin Count 84 84
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE BURST BUS; 5 PIPELINE STAGES
Address Bus Width 20 32
Bit Size 16 32
Boundary Scan NO NO
Clock Frequency-Max 26 MHz 50 MHz
External Data Bus Width 8 32
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e3
Length 29.3116 mm 29.275 mm
Low Power Mode YES NO
Number of DMA Channels
Number of External Interrupts 6
Number of Serial I/Os 2
Number of Terminals 84 84
On Chip Data RAM Width
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 4.83 mm 4.57 mm
Speed 13 MHz 25 MHz
Supply Current-Max 73 mA 300 mA
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 2.7 V 4.75 V
Supply Voltage-Nom 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 29.3116 mm 29.275 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 4
Moisture Sensitivity Level 1

Compare TN80L188EB13 with alternatives

Compare 79R3041-25JG with alternatives