TN1215-800G
vs
2N6399
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
SEMITRONICS CORP
|
| Part Package Code |
D2PAK
|
SFM
|
| Package Description |
SMALL OUTLINE, R-PSSO-G2
|
FLANGE MOUNT, R-PSFM-T3
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.30.00.80
|
8541.30.00.80
|
| Additional Feature |
HIGH RELIABILITY
|
|
| Case Connection |
ANODE
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Critical Rate of Rise of Off-State Voltage-Min |
200 V/us
|
|
| DC Gate Trigger Current-Max |
0.2 mA
|
30 mA
|
| DC Gate Trigger Voltage-Max |
1.3 V
|
1.5 V
|
| Holding Current-Max |
30 mA
|
60 mA
|
| JESD-30 Code |
R-PSSO-G2
|
R-PSFM-T3
|
| JESD-609 Code |
e3
|
|
| Leakage Current-Max |
0.005 mA
|
2 mA
|
| Moisture Sensitivity Level |
1
|
|
| Non-Repetitive Pk On-state Cur |
146 A
|
100 A
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
3
|
| On-state Current-Max |
12000 A
|
5000 A
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RMS On-state Current-Max |
12 A
|
12 A
|
| Repetitive Peak Off-state Leakage Current-Max |
5 µA
|
|
| Repetitive Peak Off-state Voltage |
800 V
|
800 V
|
| Repetitive Peak Reverse Voltage |
800 V
|
800 V
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Device Type |
SCR
|
SCR
|
| Base Number Matches |
1
|
10
|
| JEDEC-95 Code |
|
TO-220AB
|
|
|
|
Compare TN1215-800G with alternatives
Compare 2N6399 with alternatives