TMX5702134AZWTQQ1
vs
TMS5702134DZWTQQ1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
Package Description
BGA,
LFBGA,
Pin Count
337
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Additional Feature
ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY
Address Bus Width
22
Bit Size
32
32
Clock Frequency-Max
80 MHz
80 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
16
JESD-30 Code
X-PBGA-B337
S-PBGA-B337
Number of I/O Lines
16
144
Number of Terminals
337
337
Operating Temperature-Max
105 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFBGA
Package Shape
UNSPECIFIED
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE, FINE PITCH
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100
AEC-Q100
Speed
180 MHz
180 MHz
Supply Voltage-Max
1.32 V
1.32 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Rohs Code
Boundary Scan
NO
Length
16 mm
Moisture Sensitivity Level
3
On Chip Program ROM Width
8
Peak Reflow Temperature (Cel)
260
RAM (bytes)
262144
ROM (words)
2097152
Seated Height-Max
1.4 mm
Terminal Finish
TIN SILVER COPPER
Terminal Pitch
0.8 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
16 mm
Compare TMX5702134AZWTQQ1 with alternatives
Compare TMS5702134DZWTQQ1 with alternatives