TMX5702134AZWTQQ1 vs TMS5702134DZWTQQ1 feature comparison

TMX5702134AZWTQQ1 Texas Instruments

Buy Now Datasheet

TMS5702134DZWTQQ1 Texas Instruments

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA
Package Description BGA, LFBGA,
Pin Count 337
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY
Address Bus Width 22
Bit Size 32 32
Clock Frequency-Max 80 MHz 80 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width 16
JESD-30 Code X-PBGA-B337 S-PBGA-B337
Number of I/O Lines 16 144
Number of Terminals 337 337
Operating Temperature-Max 105 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Shape UNSPECIFIED SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
ROM Programmability FLASH FLASH
Screening Level AEC-Q100 AEC-Q100
Speed 180 MHz 180 MHz
Supply Voltage-Max 1.32 V 1.32 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Rohs Code Yes
Boundary Scan NO
Length 16 mm
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Peak Reflow Temperature (Cel) 260
RAM (bytes) 262144
ROM (words) 2097152
Seated Height-Max 1.4 mm
Terminal Finish TIN SILVER COPPER
Terminal Pitch 0.8 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 16 mm

Compare TMX5702134AZWTQQ1 with alternatives

Compare TMS5702134DZWTQQ1 with alternatives