TMX4C1024-12N
vs
MCM511002P12
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP,
DIP, DIP18,.3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.02
Access Mode
FAST PAGE
Access Time-Max
120 ns
120 ns
JESD-30 Code
R-PDIP-T18
R-PDIP-T18
Length
22.48 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
FAST PAGE DRAM
STATIC COLUMN DRAM
Memory Width
1
1
Number of Functions
1
Number of Ports
1
Number of Terminals
18
18
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
Organization
1MX1
1MX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
512
512
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
3
Rohs Code
I/O Type
SEPARATE
JESD-609 Code
e0
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Equivalence Code
DIP18,.3
Power Supplies
5 V
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Compare TMX4C1024-12N with alternatives