TMS5702135DZWTQQ1
vs
TMS5702135BZWTQQ1
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
LFBGA,
|
LFBGA, BGA337,19X19,32
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Has ADC |
YES
|
YES
|
Address Bus Width |
22
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
|
CPU Family |
CORTEX-R4
|
CORTEX-R4F
|
Clock Frequency-Max |
80 MHz
|
80 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
16
|
|
Format |
FLOATING POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
S-PBGA-B337
|
S-PBGA-B337
|
Length |
16 mm
|
16 mm
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
3
|
|
Number of DMA Channels |
16
|
|
Number of External Interrupts |
|
|
Number of I/O Lines |
144
|
16
|
Number of Serial I/Os |
7
|
|
Number of Terminals |
337
|
337
|
Number of Timers |
45
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
125 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
NO
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
RAM (bytes) |
262144
|
262144
|
ROM (words) |
2097152
|
2097152
|
ROM Programmability |
FLASH
|
FLASH
|
Screening Level |
AEC-Q100
|
AEC-Q100
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Speed |
180 MHz
|
180 MHz
|
Supply Current-Max |
700 mA
|
375 mA
|
Supply Voltage-Max |
1.32 V
|
1.32 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
16 mm
|
16 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
337
|
Package Equivalence Code |
|
BGA337,19X19,32
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare TMS5702135DZWTQQ1 with alternatives
Compare TMS5702135BZWTQQ1 with alternatives