TMS5701225APGEQQ1R vs TMS5701225BZWTQQ1 feature comparison

TMS5701225APGEQQ1R Texas Instruments

Buy Now Datasheet

TMS5701225BZWTQQ1 Texas Instruments

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Package Description , LFBGA, BGA337,19X19,32
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Technology CMOS CMOS
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code BGA
Pin Count 337
ECCN Code 3A991.A.2
Has ADC YES
Address Bus Width 13
Bit Size 32
CPU Family CORTEX-R4F
Clock Frequency-Max 80 MHz
DAC Channels NO
DMA Channels YES
External Data Bus Width 16
JESD-30 Code S-PBGA-B337
JESD-609 Code e1
Length 16 mm
Moisture Sensitivity Level 3
Number of I/O Lines 101
Number of Terminals 337
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA337,19X19,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 196608
ROM (words) 1310720
ROM Programmability FLASH
Screening Level AEC-Q100
Seated Height-Max 1.4 mm
Speed 180 MHz
Supply Current-Max 375 mA
Supply Voltage-Max 1.32 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Temperature Grade AUTOMOTIVE
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 16 mm

Compare TMS5701225APGEQQ1R with alternatives

Compare TMS5701225BZWTQQ1 with alternatives