TMS4464-20FML
vs
HY53C464F-80
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
SK HYNIX INC
Package Description
QCCJ, LDCC18,.33X.53
QCCJ, LDCC18,.33X.53
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
PAGE
FAST PAGE
Access Time-Max
200 ns
80 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS REFRESH
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQCC-J18
R-PQCC-J18
Length
12.446 mm
12.446 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
PAGE MODE DRAM
FAST PAGE DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
18
18
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX4
64KX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC18,.33X.53
LDCC18,.33X.53
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
256
256
Seated Height-Max
3.53 mm
3.55 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
NMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.366 mm
7.366 mm
Base Number Matches
1
1
Part Package Code
LCC
Pin Count
18
JESD-609 Code
e0
Standby Current-Max
0.002 A
Supply Current-Max
0.06 mA
Terminal Finish
TIN LEAD
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Compare HY53C464F-80 with alternatives