TMS4464-12FML vs MB81464-12P feature comparison

TMS4464-12FML Texas Instruments

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MB81464-12P FUJITSU Limited

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC FUJITSU LTD
Part Package Code QFN DIP
Package Description QCCJ, LDCC18,.33X.53 DIP-18
Pin Count 18 18
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode PAGE
Access Time-Max 120 ns 120 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type COMMON COMMON
JESD-30 Code R-PQCC-J18 R-PDIP-T18
Length 12.446 mm
Memory Density 262144 bit 262144 bit
Memory IC Type PAGE MODE DRAM PAGE MODE DRAM
Memory Width 4 4
Number of Functions 1
Number of Ports 1
Number of Terminals 18 18
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX4 64KX4
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Equivalence Code LDCC18,.33X.53 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Refresh Cycles 256 256
Seated Height-Max 3.53 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology NMOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.366 mm
Base Number Matches 1 4
JESD-609 Code e0
Supply Current-Max 0.065 mA
Terminal Finish Tin/Lead (Sn/Pb)

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Compare MB81464-12P with alternatives