TMS32C6416DGLZ5E0 vs TMS320TCI100QGLZA feature comparison

TMS32C6416DGLZ5E0 Texas Instruments

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TMS320TCI100QGLZA Texas Instruments

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description BGA-532 FBGA,
Pin Count 532 532
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3VI/O SUPPLY ALSO REQUIRES 3.3V SUPPLY FOR I/O
Address Bus Width 32 20
Barrel Shifter NO NO
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 75.18 MHz 850 MHz
External Data Bus Width 64 64
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B532 S-PBGA-B532
JESD-609 Code e0 e0
Length 23 mm 23 mm
Low Power Mode YES YES
Moisture Sensitivity Level 4 4
Number of Terminals 532 532
Operating Temperature-Max 90 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HFBGA FBGA
Package Equivalence Code BGA532,26X26,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (words) 16384
Seated Height-Max 3.3 mm 3.3 mm
Supply Voltage-Max 1.26 V 1.24 V
Supply Voltage-Min 1.14 V 1.16 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 23 mm 23 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1
Temperature Grade INDUSTRIAL

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Compare TMS320TCI100QGLZA with alternatives