TMS320VC5510GGW1 vs TMS320VC5510GGW-200 feature comparison

TMS320VC5510GGW1 Texas Instruments

Buy Now Datasheet

TMS320VC5510GGW-200 Texas Instruments

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-240 LFBGA, BGA240,17X17,32
Pin Count 240 240
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY 3.3V I/O SUPPLY
Address Bus Width 22 22
Barrel Shifter NO NO
Bit Size 16 16
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 200 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B240 S-PBGA-B240
JESD-609 Code e0
Length 15 mm 15 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 240 240
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA240,17X17,32 BGA240,17X17,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (words) 32768 163840
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max 1.65 V 1.65 V
Supply Voltage-Min 1.55 V 1.55 V
Supply Voltage-Nom 1.6 V 1.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15 mm 15 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1

Compare TMS320VC5510GGW1 with alternatives

Compare TMS320VC5510GGW-200 with alternatives