TMS320VC5510AZAVD2
vs
TMS320VC5510AZAV2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Package Description
LFBGA, BGA240,17X17,32
NFBGA-240
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Date Of Intro
2020-05-23
2020-05-23
Address Bus Width
22
22
Barrel Shifter
NO
NO
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
200 MHz
50 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B240
S-PBGA-B240
JESD-609 Code
e1
e1
Length
15 mm
15 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of DMA Channels
6
6
Number of External Interrupts
6
6
Number of Terminals
240
240
Number of Timers
2
2
On Chip Data RAM Width
16
16
On Chip Program ROM Width
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA240,17X17,32
BGA240,17X17,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
RAM (words)
163840
163840
ROM Programmability
MROM
MROM
Seated Height-Max
1.4 mm
1.4 mm
Supply Current-Max
112 mA
Supply Voltage-Max
1.65 V
1.65 V
Supply Voltage-Min
1.55 V
1.55 V
Supply Voltage-Nom
1.6 V
1.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
15 mm
15 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Pbfree Code
Samacsys Manufacturer
Texas Instruments
Compare TMS320VC5510AZAVD2 with alternatives
Compare TMS320VC5510AZAV2 with alternatives