TMS320VC5509AZHH
vs
VC55GPSGHH
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA-179
|
LFBGA, BGA179,14X14,32
|
Pin Count |
179
|
179
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Additional Feature |
ALSO OPERATES AT 1.2V AND 1.35V SUPPLY
|
|
Address Bus Width |
21
|
8
|
Barrel Shifter |
NO
|
NO
|
Bit Size |
16
|
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
50 MHz
|
20 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B179
|
S-PBGA-B179
|
JESD-609 Code |
e1
|
e0
|
Length |
12 mm
|
12 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of DMA Channels |
6
|
|
Number of External Interrupts |
5
|
|
Number of Terminals |
179
|
179
|
Number of Timers |
2
|
2
|
On Chip Data RAM Width |
16
|
16
|
On Chip Program ROM Width |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA179,14X14,32
|
BGA179,14X14,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
220
|
Qualification Status |
Not Qualified
|
|
RAM (words) |
128000
|
128000
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Supply Current-Max |
5.5 mA
|
|
Supply Voltage-Max |
1.65 V
|
1.65 V
|
Supply Voltage-Min |
1.55 V
|
1.55 V
|
Supply Voltage-Nom |
1.6 V
|
1.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Width |
12 mm
|
12 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TMS320VC5509AZHH with alternatives
Compare VC55GPSGHH with alternatives