TMS320TCI100BCLZ7
vs
TMS320C6416TGLZ6
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
23 X 23 MM, 0.80 MM PITCH, GREEN, PLASTIC, BGA-532
23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-532
Pin Count
532
532
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
23
23
Barrel Shifter
NO
NO
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
75.19 MHz
75 MHz
External Data Bus Width
64
64
Format
FIXED POINT
FIXED POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B532
S-PBGA-B532
JESD-609 Code
e1
Length
23 mm
23 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
4
Number of Terminals
532
532
Operating Temperature-Max
90 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Equivalence Code
BGA532,26X26,32
BGA532,26X26,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (words)
262144
16384
Seated Height-Max
3.3 mm
3.25 mm
Supply Voltage-Max
1.24 V
1.16 V
Supply Voltage-Min
1.16 V
1.05 V
Supply Voltage-Nom
1.2 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
23 mm
23 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
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