TMS320DM8148SCYE2
vs
DM388AAARD11FP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
Package Description
23 X 23 MM, 0.80 MM PITCH, GREEN, PLASTIC, FCBGA-684
FCBGA-609
Pin Count
684
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
5A992.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
28
28
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
30 MHz
30 MHz
External Data Bus Width
16
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B684
S-PBGA-B609
JESD-609 Code
e1
e1
Length
23 mm
16 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
4
3
Number of DMA Channels
72
72
Number of Terminals
684
609
On Chip Data RAM Width
8
8
Operating Temperature-Max
90 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
LFBGA
Package Equivalence Code
BGA684,28X28,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
250
260
Qualification Status
Not Qualified
RAM (words)
8192
655360
Seated Height-Max
3.06 mm
1.32 mm
Speed
1000 MHz
970 MHz
Supply Voltage-Max
1.42 V
1.42 V
Supply Voltage-Min
1.28 V
1.28 V
Supply Voltage-Nom
1.35 V
1.35 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
16 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare TMS320DM8148SCYE2 with alternatives
Compare DM388AAARD11FP with alternatives