TMS320DM8127SCYE3 vs AM3871CCYE100 feature comparison

TMS320DM8127SCYE3 Texas Instruments

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AM3871CCYE100 Texas Instruments

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description FBGA, FCBGA-684
Pin Count 684 684
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 5A992.C
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments Texas Instruments
Address Bus Width 28 28
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 30 MHz 30 MHz
External Data Bus Width 16 16
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B684 S-PBGA-B684
JESD-609 Code e1 e1
Length 23 mm 23 mm
Low Power Mode YES YES
Moisture Sensitivity Level 4 4
Number of DMA Channels 72 64
Number of Terminals 684 684
On Chip Data RAM Width 8 8
Operating Temperature-Max 90 °C 90 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 250 250
RAM (words) 851968 786432
Seated Height-Max 3.06 mm 3.06 mm
Speed 1000 MHz 1000 MHz
Supply Voltage-Max 1.42 V
Supply Voltage-Min 1.28 V
Supply Voltage-Nom 1.35 V 1.35 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Package Equivalence Code BGA684,28X28,32
Qualification Status Not Qualified

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