TMS320DM643GDK600
vs
TMS320DM643AZNZ6
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-548
BGA-548
Pin Count
548
548
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
20
20
Barrel Shifter
NO
NO
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
133 MHz
133 MHz
External Data Bus Width
64
64
Format
FIXED POINT
FIXED POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B548
S-PBGA-B548
JESD-609 Code
e0
e1
Length
23 mm
27 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
4
4
Number of Terminals
548
548
Operating Temperature-Max
90 °C
90 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
BGA
Package Equivalence Code
BGA548,26X26,32
BGA548,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
RAM (words)
16384
16384
Seated Height-Max
2.8 mm
2.8 mm
Supply Voltage-Max
1.44 V
1.44 V
Supply Voltage-Min
1.36 V
1.36 V
Supply Voltage-Nom
1.4 V
1.4 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
23 mm
27 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Samacsys Manufacturer
Texas Instruments
Integrated Cache
YES
Number of DMA Channels
64
Number of External Interrupts
4
Number of Timers
3
Compare TMS320DM643GDK600 with alternatives
Compare TMS320DM643AZNZ6 with alternatives