TMS320C6657CZHA25
vs
TMS320C6657CZHL25
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
21 X 21 MM, LEAD FREE, PLASTIC, BGA-625
FBGA,
Pin Count
625
625
Reach Compliance Code
compliant
unknown
ECCN Code
5A991.B.1
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Address Bus Width
24
24
Barrel Shifter
NO
NO
Bit Size
32
Boundary Scan
YES
YES
Clock Frequency-Max
1250 MHz
External Data Bus Width
16
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B625
S-PBGA-B625
JESD-609 Code
e1
Length
21 mm
21 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of DMA Channels
72
Number of Terminals
625
625
Number of Timers
8
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
245
ROM Programmability
MROM
Seated Height-Max
2.99 mm
2.99 mm
Supply Voltage-Max
1.236 V
Supply Voltage-Min
1.164 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
21 mm
21 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Compare TMS320C6657CZHA25 with alternatives
Compare TMS320C6657CZHL25 with alternatives