TMS320C6454BZTZA7
vs
TMS320C6454BGTZ
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
FBGA, BGA697,29X29,32
FBGA, BGA697,29X29,32
Pin Count
697
697
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
32
Barrel Shifter
YES
NO
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.6 MHz
50 MHz
External Data Bus Width
64
32
Format
FIXED POINT
FIXED POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B697
S-PBGA-B697
JESD-609 Code
e1
e0
Length
24 mm
24 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
4
4
Number of Terminals
697
697
Operating Temperature-Max
85 °C
90 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Equivalence Code
BGA697,29X29,32
BGA697,29X29,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
260
220
Qualification Status
Not Qualified
Not Qualified
RAM (words)
8192
262144
Seated Height-Max
3.242 mm
3.242 mm
Supply Voltage-Max
1.2875 V
1.2875 V
Supply Voltage-Min
1.2125 V
1.2125 V
Supply Voltage-Nom
1.25 V
1.25 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Width
24 mm
24 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
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