TMS320C6454BCTZA
vs
TMS320C6454BZTZ8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
FCBGA-697
24 X 24 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-697
Pin Count
697
697
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Address Bus Width
32
20
Barrel Shifter
NO
YES
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
66.6 MHz
External Data Bus Width
32
64
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B697
S-PBGA-B697
JESD-609 Code
e1
e1
Length
24 mm
24 mm
Low Power Mode
YES
NO
Moisture Sensitivity Level
4
4
Number of DMA Channels
64
Number of Terminals
697
697
Number of Timers
4
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
105 °C
90 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
245
260
ROM Programmability
MROM
Seated Height-Max
3.242 mm
3.3 mm
Supply Voltage-Max
1.2875 V
1.89 V
Supply Voltage-Min
1.2125 V
1.71 V
Supply Voltage-Nom
1.25 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
24 mm
24 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Package Equivalence Code
BGA697,29X29,32
Qualification Status
Not Qualified
RAM (words)
32768
Compare TMS320C6454BCTZA with alternatives
Compare TMS320C6454BZTZ8 with alternatives