TMS320C6416GLZ600
vs
TMX320C6416TGLZ6
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
HFBGA, BGA532,26X26,32
|
FBGA, BGA532,26X26,32
|
Pin Count |
532
|
532
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
0 TO 90 OPERATING CASE TEMPERATURE
|
|
Address Bus Width |
32
|
23
|
Barrel Shifter |
NO
|
NO
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
75.18 MHz
|
100 MHz
|
External Data Bus Width |
32
|
64
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B532
|
S-PBGA-B532
|
Length |
23 mm
|
23 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
532
|
532
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HFBGA
|
FBGA
|
Package Equivalence Code |
BGA532,26X26,32
|
BGA532,26X26,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.3 mm
|
3.3 mm
|
Supply Voltage-Max |
1.44 V
|
1.16 V
|
Supply Voltage-Min |
1.36 V
|
1.05 V
|
Supply Voltage-Nom |
1.4 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
23 mm
|
23 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
1
|
RAM (words) |
|
262144
|
|
|
|
Compare TMS320C6416GLZ600 with alternatives
Compare TMX320C6416TGLZ6 with alternatives