TMS320C6416EZLZ6E3
vs
TMS32C6416DGLZ5E0
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
HFBGA,
BGA-532
Pin Count
532
532
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
ALSO REQUIRES 3.3VI/O SUPPLY
Address Bus Width
23
32
Barrel Shifter
NO
NO
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
75.75 MHz
75.18 MHz
External Data Bus Width
64
64
Format
FIXED POINT
FIXED POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B532
S-PBGA-B532
Length
23 mm
23 mm
Low Power Mode
YES
YES
Number of Terminals
532
532
Operating Temperature-Max
90 °C
90 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HFBGA
HFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.3 mm
3.3 mm
Supply Voltage-Max
1.44 V
1.26 V
Supply Voltage-Min
1.36 V
1.14 V
Supply Voltage-Nom
1.4 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Moisture Sensitivity Level
4
Package Equivalence Code
BGA532,26X26,32
Peak Reflow Temperature (Cel)
NOT SPECIFIED
RAM (words)
16384
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare TMS320C6416EZLZ6E3 with alternatives
Compare TMS32C6416DGLZ5E0 with alternatives