TMS320C6416EZLZ6E3
vs
TMS320C6416TBGLZA6
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
HFBGA,
|
HFBGA, BGA532,26X26,32
|
| Pin Count |
532
|
532
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
ALSO REQUIRES 3.3V SUPPLY
|
| Address Bus Width |
23
|
23
|
| Barrel Shifter |
NO
|
NO
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
75.75 MHz
|
75.18 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B532
|
S-PBGA-B532
|
| Length |
23 mm
|
23 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
532
|
532
|
| Operating Temperature-Max |
90 °C
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HFBGA
|
HFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
|
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.3 mm
|
3.3 mm
|
| Supply Voltage-Max |
1.44 V
|
1.16 V
|
| Supply Voltage-Min |
1.36 V
|
1.05 V
|
| Supply Voltage-Nom |
1.4 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
23 mm
|
23 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
No
|
| Integrated Cache |
|
YES
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
4
|
| Number of DMA Channels |
|
64
|
| Number of External Interrupts |
|
4
|
| Number of Timers |
|
3
|
| On Chip Program ROM Width |
|
8
|
| Package Equivalence Code |
|
BGA532,26X26,32
|
| Peak Reflow Temperature (Cel) |
|
220
|
| RAM (words) |
|
262144
|
| ROM Programmability |
|
FLASH
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare TMS320C6416EZLZ6E3 with alternatives
Compare TMS320C6416TBGLZA6 with alternatives