TMS320C6414TBZLZ1 vs TMS32C6416DGLZA6E3 feature comparison

TMS320C6414TBZLZ1 Texas Instruments

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TMS32C6416DGLZA6E3 Texas Instruments

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description FBGA, BGA532,26X26,32 FBGA, BGA532,26X26,32
Pin Count 532 532
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 23 23
Barrel Shifter NO NO
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 75 MHz 75.75 MHz
External Data Bus Width 64 64
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B532 S-PBGA-B532
JESD-609 Code e1 e0
Length 23 mm 23 mm
Low Power Mode YES YES
Moisture Sensitivity Level 4 4
Number of Terminals 532 532
Operating Temperature-Max 90 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA532,26X26,32 BGA532,26X26,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (words) 262144 16384
Seated Height-Max 3.25 mm 3.3 mm
Supply Voltage-Max 1.24 V 1.44 V
Supply Voltage-Min 1.16 V 1.36 V
Supply Voltage-Nom 1.2 V 1.4 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 23 mm 23 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1

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