TMS320C6414TBCLZ1 vs TMS3C6416DGLZA5E0 feature comparison

TMS320C6414TBCLZ1 Texas Instruments

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TMS3C6416DGLZA5E0 Texas Instruments

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code CSP BGA
Package Description BGA-532 FBGA,
Pin Count 532 532
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments
Address Bus Width 20 23
Barrel Shifter NO NO
Bit Size 32
Boundary Scan YES YES
Clock Frequency-Max 75 MHz 75 MHz
External Data Bus Width 64 64
Format FIXED POINT FIXED POINT
Integrated Cache YES
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B532 S-PBGA-B532
JESD-609 Code e1
Length 23 mm 23 mm
Low Power Mode YES YES
Moisture Sensitivity Level 4
Number of DMA Channels 64
Number of External Interrupts 4
Number of Terminals 532 532
Number of Timers 3
On Chip Program ROM Width 8
Operating Temperature-Max 90 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA532,26X26,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (words) 4096
ROM Programmability FLASH
Seated Height-Max 3.25 mm 3.3 mm
Supply Voltage-Max 1.24 V 1.31 V
Supply Voltage-Min 1.16 V 1.19 V
Supply Voltage-Nom 1.2 V 1.25 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm 23 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1

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Compare TMS3C6416DGLZA5E0 with alternatives