TMS320C6211BZFN150
vs
TMS32C6211BGFNA150
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, ROHS COMPLIANT, PLASTIC, BGA-256
27 X 27 MM, PLASTIC, BGA-256
Pin Count
256
256
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Date Of Intro
1998-08-01
1998-08-01
Additional Feature
ALSO REQUIRES 3.3V I/O SUPPLY
ALSO REQUIRES 3.3V I/O SUPPLY
Address Bus Width
22
22
Barrel Shifter
NO
NO
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
150 MHz
150 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
27 mm
27 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
4
4
Number of DMA Channels
16
16
Number of External Interrupts
4
4
Number of Terminals
256
256
Number of Timers
2
2
Operating Temperature-Max
90 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,20X20,50
BGA256,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
220
Qualification Status
Not Qualified
Not Qualified
RAM (words)
4096
1024
Seated Height-Max
2.32 mm
2.32 mm
Supply Voltage-Max
1.89 V
1.89 V
Supply Voltage-Min
1.71 V
1.71 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Compare TMS320C6211BZFN150 with alternatives
Compare TMS32C6211BGFNA150 with alternatives