TMS320C6211BGFNA150
vs
TMS320C6211GFN180H
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA256,20X20,50
|
BGA,
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
-40 TO 105 OPERATING CASE TEMPERATURE
|
|
| Address Bus Width |
16
|
20
|
| Barrel Shifter |
NO
|
NO
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
150 MHz
|
|
| External Data Bus Width |
16
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| Length |
27 mm
|
27 mm
|
| Low Power Mode |
YES
|
NO
|
| Number of Terminals |
256
|
256
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,20X20,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (words) |
4096
|
|
| Seated Height-Max |
2.32 mm
|
2.32 mm
|
| Supply Voltage-Max |
1.85 V
|
1.89 V
|
| Supply Voltage-Min |
1.75 V
|
1.71 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
|
|
|
Compare TMS320C6211BGFNA150 with alternatives
Compare TMS320C6211GFN180H with alternatives