TMS320C6211BGFN167 vs TMS320C6711BGFN100 feature comparison

TMS320C6211BGFN167 Texas Instruments

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TMS320C6711BGFN100 Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description BGA-256 BGA, BGA256,20X20,50
Pin Count 256 256
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments
Additional Feature ALSO REQUIRES 3.3V I/O SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 22 22
Barrel Shifter NO NO
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 167 MHz 100 MHz
External Data Bus Width 32 32
Format FIXED POINT FLOATING POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 4
Number of Terminals 256 256
Operating Temperature-Max 90 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,20X20,50 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (words) 4096 18432
Seated Height-Max 2.32 mm 2.32 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1

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