TMS29LF008B-90DCDLB
vs
TMS29LF008B-90DCDQB
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
TSSOP, TSSOP40,.8,20
|
TSSOP, TSSOP40,.8,20
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
90 ns
|
90 ns
|
Boot Block |
BOTTOM
|
BOTTOM
|
Command User Interface |
YES
|
YES
|
Data Polling |
YES
|
YES
|
Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
JESD-30 Code |
R-PDSO-G40
|
R-PDSO-G40
|
Memory Density |
8388608 bit
|
8388608 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Number of Sectors/Size |
1,2,1,15
|
1,2,1,15
|
Number of Terminals |
40
|
40
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
1MX8
|
1MX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP40,.8,20
|
TSSOP40,.8,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Ready/Busy |
YES
|
YES
|
Sector Size |
16K,8K,32K,64K
|
16K,8K,32K,64K
|
Standby Current-Max |
0.000005 A
|
0.000005 A
|
Supply Current-Max |
0.06 mA
|
0.06 mA
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Toggle Bit |
YES
|
YES
|
Type |
NOR TYPE
|
NOR TYPE
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TMS29LF008B-90DCDLB with alternatives
Compare TMS29LF008B-90DCDQB with alternatives