TMPN3120FE3M
vs
MC143120E2DWR2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP32,.56
|
SOP,
|
| Pin Count |
32
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
20 MHz
|
10 MHz
|
| Communication Protocol |
MIL STD 1553A; MIL STD 1553B; MIL STD 1760; STANAG 3838
|
MIL STD 1553
|
| Data Encoding/Decoding Method |
NRZ
|
BIPH-SPACE(FM0)
|
| Data Transfer Rate-Max |
0.3125 MBps
|
0.15625 MBps
|
| External Data Bus Width |
|
8
|
| JESD-30 Code |
R-PDSO-G32
|
R-PDSO-G32
|
| JESD-609 Code |
e0
|
|
| Length |
20.6 mm
|
20.96 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
11
|
11
|
| Number of Serial I/Os |
5
|
1
|
| Number of Terminals |
32
|
32
|
| On Chip Data RAM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP32,.56
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
1024
|
1024
|
| Seated Height-Max |
2.8 mm
|
2.54 mm
|
| Supply Current-Max |
55 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
MOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.7 mm
|
10.92 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
3
|
1
|
| Additional Feature |
|
3 PIPELINED PROCESSORS; 10K X 8 INTERNAL ROM; 2K X 8 EEPROM
|
|
|
|
Compare TMPN3120FE3M with alternatives
Compare MC143120E2DWR2 with alternatives