TMP87PH47LUG
vs
TMP87PH47LU
feature comparison
| Part Life Cycle Code |
End Of Life
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
TOSHIBA CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
10 X 10 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, LQFP-44
|
QFP, QFP44,.5SQ,32
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES AT 2.7V MIN SUPPLY
|
ALSO OPERATES AT 2.7V MIN SUPPLY
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
4.2 MHz
|
4.2 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQFP-G44
|
| Length |
10 mm
|
10 mm
|
| Number of I/O Lines |
37
|
37
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-30 °C
|
-30 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
OTPROM
|
OTPROM
|
| Seated Height-Max |
1.7 mm
|
1.9 mm
|
| Speed |
4.2 MHz
|
4.2 MHz
|
| Supply Voltage-Max |
4 V
|
4 V
|
| Supply Voltage-Min |
1.8 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| CPU Family |
|
TLCS-870
|
| JESD-609 Code |
|
e0
|
| On Chip Program ROM Width |
|
8
|
| Package Equivalence Code |
|
QFP44,.5SQ,32
|
| RAM (bytes) |
|
512
|
| ROM (words) |
|
16384
|
| Supply Current-Max |
|
14 mA
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|