TMP87C807U
vs
TMP87PH47UG
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
End Of Life
|
| Ihs Manufacturer |
TOSHIBA CORP
|
TOSHIBA CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP,
|
10 X 10 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, LQFP-44
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
YES
|
| Additional Feature |
OPERATES AT 2.7 V MINIMUM SUPPLY @ 4.2 MHZ
|
OPERATES AT 2.7V MIN SUPPLY @ 4.2 MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
8 MHz
|
8 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQFP-G44
|
| Length |
10 mm
|
10 mm
|
| Number of I/O Lines |
37
|
37
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-30 °C
|
-30 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
LQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
MROM
|
OTPROM
|
| Seated Height-Max |
3.05 mm
|
1.7 mm
|
| Speed |
8 MHz
|
8 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
10 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|