TMP68HC003DF-12 vs S80L188EB16 feature comparison

TMP68HC003DF-12 Toshiba America Electronic Components

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S80L188EB16 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP INTEL CORP
Package Description QFP, QFP-80
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01
Additional Feature IT CAN ALSO OPERATE AT 5V +/-5% SUPPLY, BUILT-IN CLOCK GENERATOR DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
Address Bus Width 24 20
Boundary Scan NO NO
Clock Frequency-Max 4 MHz 32 MHz
External Data Bus Width 16 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G80 R-PQFP-G80
Low Power Mode YES YES
Number of Terminals 80 80
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK FLATPACK
Qualification Status Not Qualified Not Qualified
Speed 4 MHz 16 MHz
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 3 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 2
Rohs Code No
Part Package Code QFP
Pin Count 80
Bit Size 16
JESD-609 Code e0
Length 20 mm
Number of DMA Channels
Number of External Interrupts 6
Number of Serial I/Os 2
On Chip Data RAM Width
Package Equivalence Code QFP80,.7X.9,32
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 3/5 V
RAM (words) 0
Seated Height-Max 3.15 mm
Supply Current-Max 54 mA
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 0.8 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

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Compare S80L188EB16 with alternatives