TMP68HC000P-16
vs
MC68HC000CR10
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
MOTOROLA INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
64
64
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
23
23
Bit Size
16
32
Boundary Scan
NO
NO
Clock Frequency-Max
16.67 MHz
10 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-PDIP-T64
R-PDIP-T64
JESD-609 Code
e0
Length
81.5 mm
81.535 mm
Low Power Mode
YES
NO
Number of DMA Channels
Number of External Interrupts
7
7
Number of Serial I/Os
Number of Terminals
64
64
On Chip Data RAM Width
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
0
Seated Height-Max
5.66 mm
5.84 mm
Speed
16.67 MHz
10 MHz
Supply Current-Max
50 mA
30 mA
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
22.86 mm
22.86 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
2
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Compare MC68HC000CR10 with alternatives