TMP19A63F10XBG
vs
MCIMX285AVM4B
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
End Of Life
|
Not Recommended
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
TFBGA, BGA289,20X20,20
|
MABGA-289
|
| Pin Count |
289
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
SEATED HGT-NOM
|
IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
13.5 MHz
|
|
| External Data Bus Width |
16
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-PBGA-B289
|
S-PBGA-B289
|
| Length |
11 mm
|
14 mm
|
| Low Power Mode |
YES
|
|
| Number of Terminals |
289
|
289
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA289,20X20,20
|
BGA289,17X17,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
49152
|
|
| ROM (words) |
1048576
|
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
1.06 mm
|
1.37 mm
|
| Speed |
54 MHz
|
|
| Supply Current-Max |
70 mA
|
|
| Supply Voltage-Max |
1.65 V
|
1.55 V
|
| Supply Voltage-Min |
1.35 V
|
1.35 V
|
| Supply Voltage-Nom |
1.5 V
|
1.45 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
11 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
SoC
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
5A992.C
|
| Factory Lead Time |
|
18 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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